Lenovo details the cooling capabilities of Legion Y70

Lenovo details the cooling capabilities of Legion Y70

On August 18, Lenovo will unveil the Legion Y70 smartphone and the firm has already released key details about the new flagship. It continued today with a variety of teases that provided further information on the phone’s cooling powers.

The business will release a whopping 5,047 sq.mm of 0.55 mm thick VC cooling. Yes, the chamber will have a half-millimeter-wide profile.

The base thickness of the Lenovo Legion Y70, which is 7.99mm sans the protruding 50MP camera with OIS, will be exceptionally slim overall.

The phone is being promoted next to a refrigerator since it is evident that the device will bring 10 layers of heat dissipation materials and solutions.

As we can see, the new Legion smartphone seeks to preserve the sub-gaming brand’s heritage while maintaining a more approachable appearance and feel.

For mobile gamers, there won’t be shoulder triggers or a significantly altered user interface, but the Snapdragon 8+ Gen 1, 68W fast charging and up to 16GB RAM are still anticipated to deliver the best performance.

Leave a Reply

Your email address will not be published.