We’re all prepared for the Red Magic 7 announcement which is set on February 17 but before the big event nubia shared multiple new teasers for its upcoming gaming flagship. Red Magic 7 will feature an independent gaming chipset dubbed Red Core No. 1. Based on the teaser the chip will process sound, light, vibration and touch inputs.
The new teasers also detailed the phone’s elaborate heat dissipation system through a teardown video as well as several new posters. Red Magic 7 will bring a multi-stage cooling system with a 20,000RPM active cooling fan featuring enhanced air pressure and airflow with reduced noise compared to the outgoing Red Magic 7 series.
The phone will also house the largest-ever VC cooling plate covering a total area of 41,279mm2 – 30% larger than its predecessor. Furthermore, nubia will offer a separate active cooling case. Red Magic 7 will also be the first gaming phone with an under-display camera but there is no detail regarding if all versions will come with the fancy new UD cam nor what resolution the image sensor is.
In more related news, Red Magic 7 appeared in a Geekbench listing yet again confirms the Red Magic 7 will bring Qualcomm’s Snapdragon 8 Gen 1 chip. We can also see the version in the test (NX709J) brings 16GB RAM and runs Android 12.
It managed a respectable 1,264-points in the single-core test and 3,744-points in the multi-core section. The Wi-Fi Alliance confirms the device will bring dual-band Wi-Fi connectivity and Android 12.
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